• API
  • 中文

(Standard Leadtime :5 Weeks) 0

Quantity Price
24 17.52375

1 10 100 1000 2500 Updated
* 30-6625-51 2970 USD
* 30-6625-31 6930 USD
* 30-6625-11 6084 USD
* 30-6625-71 3472 USD
* 30-6625-10 3508 USD
* 30-6625-21 4482 USD
* 30-6625-70 8352 USD
* 30-6625-20 8658 USD
* 30-6621-30 5490 USD
* 30-6625-20 0
* 30-6625-70 0
* 30-6625-21 0
* 30-6625-10 0
* 30-6625-71 0
* 30-6625-11 0
* 30-6625-31 0
* 30-6625-51 0
* 30-6621-30 0 USD
* 30-6625-51 Please Inquiry USD
* 30-6625-10 Please Inquiry USD
* 30-6625-70 Please Inquiry USD

TYPEDESCRIPTION
MfrAries Electronics
Series6621
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)30 (2 x 15)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating200.0µin (5.08µm)
Contact Material - MatingPhosphor Bronze
Mounting TypeThrough Hole, Bottom Entry; Through Board
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
Termination Post Length0.150" (3.81mm)
Material Flammability RatingUL94 V-0
Current Rating (Amps)1.5 A
Contact Resistance-
Base Product Number30-6621


Aries Electronics
CONN IC DIP SOCKET 30POS TIN
30 (2 x 15) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole, Bottom Entry; Through Board