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(Standard Leadtime :5 Weeks) 0

Quantity Price
35 13.69171

1 10 100 1000 2500 Updated
* 30-351 100 USD
* 30-354B 0 USD
* 30-354 0 USD
* 30-355 0 USD
* 30-3503-31 5382 USD
* 30-3503-21 8802 USD
* 30-3513-11H 8100 USD
* 30-3503-30 3438 USD
* 30-3503-20 2232 USD
* 30-3513-10H 2754 USD
* 30-3513-11 6552 USD
* 30-3513-10 5436 USD
* 30-3513-10T 5022 USD
* 30-3501 0 14.32000 12.53000
* 30-3583 0
* 30-3511 12 49.68000
* 30-3513-10 0
* 30-3513-10T 0
* 30-3513-11 0
* 30-3513-10H 0
* 30-3503-20 0
* 30-3503-30 0
* 30-3503-21 0
* 30-3503-31 0
* 30-3501 6 USD
* 30-3534 1 USD 208.1
* 30-3562 87 USD 42.96 37.56
* 30-3552 1 USD 151.74
* 30-3533 1 USD 206.17
* 30-3561 1 USD 157.74
* 30-3581 309 USD 34.8
* 30-3583 1 USD 193.75
* 30-3532 17 USD
* 30-3554 1 USD 222.11
* 30-3556 6 USD
* 30-3502 103 USD 12.53
* 30-3550 1 USD 153.8
* 30-3511 12 USD
* 30-3513-10H 0 USD
* 30-3503-30 0 USD
* 30-3503-20 0 USD
* 30-3503-31 0 USD
* 30-3503-21 0 USD
* 30-3503-21 0 USD
* 30-3503-21 0 USD
* 30-3513-10 Please Inquiry USD
* 30-3513-11H Please Inquiry USD
* 30-3513-11 Please Inquiry USD
* 30-3503-31 Please Inquiry USD

TYPEDESCRIPTION
MfrAries Electronics
SeriesLo-PRO®file, 513
PackageBulk
Product StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)30 (2 x 15)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating (Amps)3 A
Contact Resistance-
Base Product Number30-3513


Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
30 (2 x 15) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole